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PhotoChemical Machining
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Applications:-
Apertures, Bus Bars, Chip Carriers,
Drive Bands, Electrical Contacts, Electron Grids, Enclosures, Encoder Disks,
Filters, Flat Springs, Fluidic Circuit Plates, Gaskets, Gimbal Springs,
Heat Sinks, Hybrid Lids, Instrument Panels, Interconnects, Jewelry, Laminations,
Lead Frames, Magnetic Laminate Motors, Masks, Microwave Fuses, Ornaments,
Print Bands, RFI/EMI Shielding,
Radial Springs, Recording Heads, Reticles, Shims, Sheilds, Shutter Blades,
Spring Steel, Step Lids, Strain Gauges, Vacuum Tube Parts, Valve Plates,
Washers.
Materials:-
Aluminum, Beryllium Copper,
Bimetal, Brass, Ceramic, Chromium, Cold Rolled Steel, Copper, Copper-Nickel,
Cusil, Elinvar, Elgiloy, Epoxy, Glass, Gold, Hastelloy, Havar, Hipernom,
Hymu, Inconel, Invar, Kapton, Kovar, Lead, Magnesium, Manganese, Molybdenum,
Monel, Mumetal, Mylar, Nichrome, Nickel, Nickel Silver, Nicoseal, Ni Span,
Permalloy, Permendur, Pewter, Polyesters, Polymides, Rehnium, Rexotherm,
Rodar, Rodflex, Silicon Steel, Silver, Soft Magnetic Alloys, Stainless
Steel, Therlo, Tin, Titanium, Udimet, Vanadium, Zinc, Zirconium,
Tolerance capabilities:-
Holes centers +/- 0.0005" are
achievable.
Hole dimensions and depth. There
are a number of variables that affect hole tolerances such as material
selection/thickness part size, tabbing, production quantity and target
costs. We therefor suggest contacting manufacturing in the early design
stages.
Design guidelines:-
Material thickness 0.0005" to
0.1" .
Holes minimum dia. approximatly
equal to plate thickness.
Minimum metal between holes
approximatly equal to metal thickness.
Minimum radii, approximatly
equal to plate thickness.
Sheet size upto 40"*120".
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